Emerging Technology for in situ processing : Patterning Alternatives

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)895
Journal / PublicationJournal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
Volume6
Issue number3
Publication statusPublished - May 1988
Externally publishedYes

Abstract

In situ processing methods would permit fabrication of semiconductor devices by simplified methods and without exposure of surfaces to air, liquids, or a processing atmosphere shared with human operators. The principal alternative patterning methods which would replace current lithography in such schemes are reviewed briefly.

Citation Format(s)

Emerging Technology for in situ processing : Patterning Alternatives. / Ehrlich, D. J. ; Black, J. G. ; Rothschild, M. ; Pang, S. W.

In: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 6, No. 3, 05.1988, p. 895 .

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review