Emerging Technology for in situ processing: Patterning Alternatives

D. J.  Ehrlich; J. G.  Black; M.  Rothschild; S. W. Pang

doi:10.1116/1.584318

Emerging Technology for in situ processing: Patterning Alternatives

D. J. Ehrlich, J. G. Black, M. Rothschild, S. W. Pang

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Abstract

In situ processing methods would permit fabrication of semiconductor devices by simplified methods and without exposure of surfaces to air, liquids, or a processing atmosphere shared with human operators. The principal alternative patterning methods which would replace current lithography in such schemes are reviewed briefly.

Original language	English
Pages (from-to)	895
Journal	Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
Volume	6
Issue number	3
DOIs	https://doi.org/10.1116/1.584318
Publication status	Published - May 1988
Externally published	Yes

Access Output

10.1116/1.584318

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@article{ded3fe4513bf4622a0836a9251bcdd8a,

title = "Emerging Technology for in situ processing: Patterning Alternatives",

abstract = "In situ processing methods would permit fabrication of semiconductor devices by simplified methods and without exposure of surfaces to air, liquids, or a processing atmosphere shared with human operators. The principal alternative patterning methods which would replace current lithography in such schemes are reviewed briefly.",

author = "Ehrlich, {D. J.} and Black, {J. G.} and M. Rothschild and Pang, {S. W.}",

year = "1988",

month = may,

doi = "10.1116/1.584318",

language = "English",

volume = "6",

pages = "895 ",

number = "3",

}

Emerging Technology for in situ processing: Patterning Alternatives. / Ehrlich, D. J. ; Black, J. G. ; Rothschild, M. et al.
In: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 6, No. 3, 05.1988, p. 895 .

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

TY - JOUR

T1 - Emerging Technology for in situ processing

T2 - Patterning Alternatives

AU - Ehrlich, D. J.

AU - Black, J. G.

AU - Rothschild, M.

AU - Pang, S. W.

PY - 1988/5

Y1 - 1988/5

N2 - In situ processing methods would permit fabrication of semiconductor devices by simplified methods and without exposure of surfaces to air, liquids, or a processing atmosphere shared with human operators. The principal alternative patterning methods which would replace current lithography in such schemes are reviewed briefly.

AB - In situ processing methods would permit fabrication of semiconductor devices by simplified methods and without exposure of surfaces to air, liquids, or a processing atmosphere shared with human operators. The principal alternative patterning methods which would replace current lithography in such schemes are reviewed briefly.

U2 - 10.1116/1.584318

DO - 10.1116/1.584318

M3 - RGC 21 - Publication in refereed journal

VL - 6

SP - 895

JO - Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena

JF - Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena

IS - 3

ER -

Emerging Technology for in situ processing: Patterning Alternatives

Abstract

Access Output

Other Access Options

Permanent Link

Fingerprint

Cite this