Eliminate Kirkendall voids in solder reactions on nanotwinned copper
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 241-244 |
| Journal / Publication | Scripta Materialia |
| Volume | 68 |
| Issue number | 5 |
| Publication status | Published - Mar 2013 |
| Externally published | Yes |
Link(s)
Abstract
Electroplating was used to fabricate a high density of nanotwins that exhibited the preferred (1 1 1) orientation in Cu. We found no formation of Kirkendall voids in solder reactions on the nanotwinned Cu. This was due to the high density of steps and kinks on the nanotwin boundaries, which serve as vacancy sinks. Thus the vacancy concentration cannot reach supersaturation and nucleate voids. The finding is a significant advance in the problem of solder joint reliability in microelectronic three-dimensional integrated circuit devices. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Research Area(s)
- Copper, Diffusion, Kirkendall voids, Nanostructured materials, Twinning
Bibliographic Note
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Citation Format(s)
Eliminate Kirkendall voids in solder reactions on nanotwinned copper. / Liu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa et al.
In: Scripta Materialia, Vol. 68, No. 5, 03.2013, p. 241-244.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
