Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 2490-2492 |
| Journal / Publication | Applied Physics Letters |
| Volume | 85 |
| Issue number | 13 |
| Publication status | Published - 27 Sep 2004 |
| Externally published | Yes |
Link(s)
Abstract
A grain-by-grain analysis of the microstructural evolution in Sn stripe under electromigration using synchrotron-based white beam x-ray microdiffraction was investigated. Grain-by-grain analysis was obtained from the diffracted Laue patterns about the changes of grain orientation before and after electromigration. It was observed that high-resistance grains reorient with respect to the neighboring low-resistance grains. A different mechanism of grain growth under electromigration from the normal grain growth was also proposed and discussed.
Bibliographic Note
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Citation Format(s)
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction. / Wu, Albert T.; Tu, K. N.; Lloyd, J. R. et al.
In: Applied Physics Letters, Vol. 85, No. 13, 27.09.2004, p. 2490-2492.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
