Electromigration induced thermomigration in microbumps by thermal cross-talk across neighboring chips in 2.5D IC
- Menglu Li
- , K. N. Tu
- , Dong-Wook Kim
- , Sam Gu
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
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