Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Author(s)

  • W. H. Lin
  • Albert T. Wu
  • S. Z. Lin
  • T. H. Chuang
  • K. N. Tu

Detail(s)

Original languageEnglish
Pages (from-to)753-759
Journal / PublicationJournal of Electronic Materials
Volume36
Issue number7
Publication statusPublished - Jul 2007
Externally publishedYes

Link(s)

DOI

DOI
Check@CityULib
Link to Scopus https://www.scopus.com/record/display.uri?eid=2-s2.0-34547456938&origin=recordpage
Permanent Link https://scholars.cityu.edu.hk/en/publications/publication(b1849b84-736f-4d1c-894d-5bd1e1f6a159).html

Abstract

Electromigration in Sn-8Zn-3Bi flip chip solder bumps on Cu pads has been studied at 120°C with an average current density of 4 × 10 3 A/cm 2 and 4.5 × 10 4 A/cm 2. Due to the polarity effect, the thickness of the intermetallic compound Cu-Zn (γ-phase) formed at the anode is much greater than that at the cathode. The solder joint fails after 117 h of stressing at 4.5 × 10 4 A/cm 2, and void formation at the cathode can clearly be seen after polishing. However, it is the melting at the edge of the bump that causes the solder joint to fail. A simulation of the current density distribution indicates that the current density is not distributed uniformly, and current crowding occurs inside the bump. The results indicate that the increase of current density associated with Joule heating has affected melting and enhanced damage in the solder joint during electromigration. © 2007 TMS.

Research Area(s)

  • Current crowding, Electromigration, Flip chip, Joule heating, Sn-8Zn-3Bi

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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Publication fingerprints text

100
Solder Joint Keyphrases
100
Copper Pad Keyphrases
100
Flip Chip Solder Jo... Keyphrases
100
Electromigration Keyphrases
100
copper INIS
100
current density INIS
100
electromigration INIS
100
Density Material Science
100
Copper Material Science
66
Current Density Keyphrases
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Citation Format(s)

[ RIS ] [ BibTeX ]
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads. / Lin, W. H.; Wu, Albert T.; Lin, S. Z. et al.
In: Journal of Electronic Materials, Vol. 36, No. 7, 07.2007, p. 753-759.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review