Abstract
Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flip-chip solder joint has a built-in current-crowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead-free solder alloys, the authors prepared solder lines in v-grooves etched on Si(001). This article discusses the results of those tests and compares the electromigration failure modes of eutectic SnPb and SnAgCu flip-chip solder joints along with the mean-time-to-failure.
| Original language | English |
|---|---|
| Pages (from-to) | 34-37 |
| Journal | JOM |
| Volume | 54 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - Jun 2002 |
| Externally published | Yes |
Bibliographical note
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