Electromigration in solder joints and solder lines
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 34-37 |
Journal / Publication | JOM |
Volume | 54 |
Issue number | 6 |
Publication status | Published - Jun 2002 |
Externally published | Yes |
Link(s)
Abstract
Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flip-chip solder joint has a built-in current-crowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead-free solder alloys, the authors prepared solder lines in v-grooves etched on Si(001). This article discusses the results of those tests and compares the electromigration failure modes of eutectic SnPb and SnAgCu flip-chip solder joints along with the mean-time-to-failure.
Bibliographic Note
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Citation Format(s)
Electromigration in solder joints and solder lines. / Gan, H.; Choi, W. J.; Xu, G. et al.
In: JOM, Vol. 54, No. 6, 06.2002, p. 34-37.
In: JOM, Vol. 54, No. 6, 06.2002, p. 34-37.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review