Electromigration in solder joints and solder lines

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

74 Scopus Citations
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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)34-37
Journal / PublicationJOM
Volume54
Issue number6
Publication statusPublished - Jun 2002
Externally publishedYes

Abstract

Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flip-chip solder joint has a built-in current-crowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead-free solder alloys, the authors prepared solder lines in v-grooves etched on Si(001). This article discusses the results of those tests and compares the electromigration failure modes of eutectic SnPb and SnAgCu flip-chip solder joints along with the mean-time-to-failure.

Bibliographic Note

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Citation Format(s)

Electromigration in solder joints and solder lines. / Gan, H.; Choi, W. J.; Xu, G. et al.
In: JOM, Vol. 54, No. 6, 06.2002, p. 34-37.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review