Electromigration in Sn-Pb solder strips as a function of alloy composition

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

154 Scopus Citations
View graph of relations

Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)5703-5709
Journal / PublicationJournal of Applied Physics
Volume88
Issue number10
Publication statusPublished - 15 Nov 2000
Externally publishedYes

Abstract

Using thin film solder strips, we have investigated the electromigration of six different compositions of Sn-Pb solders at current density of 105 A/cm2 near ambient temperature. The six compositions are pure Sn, Sn80Pb20, Sn70Pb30, Sn62Pb38 (eutectic), Sn40Pb60, and Sn5Pb95. The eutectic alloy, with the lowest melting point and a high density of lamella interfaces, was found to have the fastest hillock growth. As composition moving toward the two terminal phases, the hillock growth rate decreases; but it increases again in pure Sn. The interface between Sn and Pb, being the fastest kinetic path of mass transport, also serves as the place to initiate hillock and void formation. © 2000 American Institute of Physics.

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to lbscholars@cityu.edu.hk.

Citation Format(s)

Electromigration in Sn-Pb solder strips as a function of alloy composition. / Liu, C. Y.; Chen, Chih; Tu, K. N.
In: Journal of Applied Physics, Vol. 88, No. 10, 15.11.2000, p. 5703-5709.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review