Electromigration in Sn-Pb solder strips as a function of alloy composition

C. Y. Liu; Chih Chen; K. N. Tu

doi:10.1063/1.1319327

Electromigration in Sn-Pb solder strips as a function of alloy composition

C. Y. Liu
, Chih Chen
, K. N. Tu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

157 Citations (Scopus)

Abstract

Using thin film solder strips, we have investigated the electromigration of six different compositions of Sn-Pb solders at current density of 10⁵ A/cm² near ambient temperature. The six compositions are pure Sn, Sn₈₀Pb₂₀, Sn₇₀Pb₃₀, Sn₆₂Pb₃₈ (eutectic), Sn₄₀Pb₆₀, and Sn₅Pb₉₅. The eutectic alloy, with the lowest melting point and a high density of lamella interfaces, was found to have the fastest hillock growth. As composition moving toward the two terminal phases, the hillock growth rate decreases; but it increases again in pure Sn. The interface between Sn and Pb, being the fastest kinetic path of mass transport, also serves as the place to initiate hillock and void formation. © 2000 American Institute of Physics.

Original language	English
Pages (from-to)	5703-5709
Journal	Journal of Applied Physics
Volume	88
Issue number	10
DOIs	https://doi.org/10.1063/1.1319327
Publication status	Published - 15 Nov 2000
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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@article{2eb9ca45ba2740cf8f136d4f762ef5ce,

title = "Electromigration in Sn-Pb solder strips as a function of alloy composition",

abstract = "Using thin film solder strips, we have investigated the electromigration of six different compositions of Sn-Pb solders at current density of 105 A/cm2 near ambient temperature. The six compositions are pure Sn, Sn80Pb20, Sn70Pb30, Sn62Pb38 (eutectic), Sn40Pb60, and Sn5Pb95. The eutectic alloy, with the lowest melting point and a high density of lamella interfaces, was found to have the fastest hillock growth. As composition moving toward the two terminal phases, the hillock growth rate decreases; but it increases again in pure Sn. The interface between Sn and Pb, being the fastest kinetic path of mass transport, also serves as the place to initiate hillock and void formation. {\textcopyright} 2000 American Institute of Physics.",

author = "Liu, \{C. Y.\} and Chih Chen and Tu, \{K. N.\}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected]. ",

year = "2000",

month = nov,

day = "15",

doi = "10.1063/1.1319327",

language = "English",

volume = "88",

pages = "5703--5709",

journal = "Journal of Applied Physics",

issn = "0021-8979",

publisher = "American Institute of Physics",

number = "10",

}

TY - JOUR

T1 - Electromigration in Sn-Pb solder strips as a function of alloy composition

AU - Liu, C. Y.

AU - Chen, Chih

AU - Tu, K. N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2000/11/15

Y1 - 2000/11/15

N2 - Using thin film solder strips, we have investigated the electromigration of six different compositions of Sn-Pb solders at current density of 105 A/cm2 near ambient temperature. The six compositions are pure Sn, Sn80Pb20, Sn70Pb30, Sn62Pb38 (eutectic), Sn40Pb60, and Sn5Pb95. The eutectic alloy, with the lowest melting point and a high density of lamella interfaces, was found to have the fastest hillock growth. As composition moving toward the two terminal phases, the hillock growth rate decreases; but it increases again in pure Sn. The interface between Sn and Pb, being the fastest kinetic path of mass transport, also serves as the place to initiate hillock and void formation. © 2000 American Institute of Physics.

AB - Using thin film solder strips, we have investigated the electromigration of six different compositions of Sn-Pb solders at current density of 105 A/cm2 near ambient temperature. The six compositions are pure Sn, Sn80Pb20, Sn70Pb30, Sn62Pb38 (eutectic), Sn40Pb60, and Sn5Pb95. The eutectic alloy, with the lowest melting point and a high density of lamella interfaces, was found to have the fastest hillock growth. As composition moving toward the two terminal phases, the hillock growth rate decreases; but it increases again in pure Sn. The interface between Sn and Pb, being the fastest kinetic path of mass transport, also serves as the place to initiate hillock and void formation. © 2000 American Institute of Physics.

UR - https://www.scopus.com/pages/publications/0000145348

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0000145348&origin=recordpage

U2 - 10.1063/1.1319327

DO - 10.1063/1.1319327

M3 - RGC 21 - Publication in refereed journal

SN - 0021-8979

VL - 88

SP - 5703

EP - 5709

JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 10

ER -

Electromigration in Sn-Pb solder strips as a function of alloy composition

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