Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Y. C. Hu; Y. H. Lin; C. R. Kao; K. N. Tu

doi:10.1557/JMR.2003.0355

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Y. C. Hu
, Y. H. Lin
, C. R. Kao
, K. N. Tu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

139 Citations (Scopus)

Abstract

An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu₆Sn₅ was formed there.

Original language	English
Pages (from-to)	2544-2548
Journal	Journal of Materials Research
Volume	18
Issue number	11
DOIs	https://doi.org/10.1557/JMR.2003.0355
Publication status	Published - Nov 2003
Externally published	Yes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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@article{22ba7cc49a654250b03027f79c4ca2f5,

title = "Electromigration failure in flip chip solder joints due to rapid dissolution of copper",

abstract = "An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.",

author = "Hu, \{Y. C.\} and Lin, \{Y. H.\} and Kao, \{C. R.\} and Tu, \{K. N.\}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

year = "2003",

month = nov,

doi = "10.1557/JMR.2003.0355",

language = "English",

volume = "18",

pages = "2544--2548",

journal = "Journal of Materials Research",

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TY - JOUR

T1 - Electromigration failure in flip chip solder joints due to rapid dissolution of copper

AU - Hu, Y. C.

AU - Lin, Y. H.

AU - Kao, C. R.

AU - Tu, K. N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2003/11

Y1 - 2003/11

N2 - An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.

AB - An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.

UR - https://www.scopus.com/pages/publications/0242468675

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0242468675&origin=recordpage

U2 - 10.1557/JMR.2003.0355

DO - 10.1557/JMR.2003.0355

M3 - RGC 21 - Publication in refereed journal

SN - 0884-2914

VL - 18

SP - 2544

EP - 2548

JO - Journal of Materials Research

JF - Journal of Materials Research

IS - 11

ER -

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Abstract

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