Abstract
Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging industry due to environmental concerns. Both electromigration (EM) and thermomigration (TM) have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. We review the unique features of EM and TM in flip-chip solder bumps, emphasizing the effects of current crowding and Joule heating. In addition, the challenges to a better understanding of EM and TM in Pb-free solders are discussed. For example, the anisotropic nature of Sn microstructure in Pb-free solders can enhance the dissolution rates of Ni and Cu in solders driven by EM and TM. © 2010 by Annual Reviews. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 531-555 |
| Journal | Annual Review of Materials Research |
| Volume | 40 |
| DOIs | |
| Publication status | Published - 2010 |
| Externally published | Yes |
Bibliographical note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].Research Keywords
- current stressing
- diffusion
- Joule heating
- microelectronic packaging
- reliability
- thermal gradient
- underbump metallization
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