Electromigration and thermomigration in flip chip solder joints

K. N. Tu; Annie Huang; Fan-Yi Ouyang

doi:10.1109/EMAP.2006.4430563

Electromigration and thermomigration in flip chip solder joints

K. N. Tu, Annie Huang, Fan-Yi Ouyang

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Original language	English
Title of host publication	2006 International Conference on Electronic Materials and Packaging, EMAP
DOIs	https://doi.org/10.1109/EMAP.2006.4430563
Publication status	Published - 2006
Externally published	Yes
Event	2006 International Conference on Electronic Materials and Packaging, EMAP - Kowloon, China Duration: 11 Dec 2006 → 14 Dec 2006

Publication series

Name	2006 International Conference on Electronic Materials and Packaging, EMAP

Conference

Conference	2006 International Conference on Electronic Materials and Packaging, EMAP
Place	China
City	Kowloon
Period	11/12/06 → 14/12/06

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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10.1109/EMAP.2006.4430563

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@inproceedings{c1237368043f4ee98bc47c017d4e6612,

title = "Electromigration and thermomigration in flip chip solder joints",

author = "Tu, {K. N.} and Annie Huang and Fan-Yi Ouyang",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected]. ; 2006 International Conference on Electronic Materials and Packaging, EMAP ; Conference date: 11-12-2006 Through 14-12-2006",

year = "2006",

doi = "10.1109/EMAP.2006.4430563",

language = "English",

isbn = "1424408342",

series = "2006 International Conference on Electronic Materials and Packaging, EMAP",

booktitle = "2006 International Conference on Electronic Materials and Packaging, EMAP",

}

Tu, KN, Huang, A & Ouyang, F-Y 2006, Electromigration and thermomigration in flip chip solder joints. in 2006 International Conference on Electronic Materials and Packaging, EMAP., 4430563, 2006 International Conference on Electronic Materials and Packaging, EMAP, 2006 International Conference on Electronic Materials and Packaging, EMAP, Kowloon, China, 11/12/06. https://doi.org/10.1109/EMAP.2006.4430563

Electromigration and thermomigration in flip chip solder joints. / Tu, K. N.; Huang, Annie; Ouyang, Fan-Yi.
2006 International Conference on Electronic Materials and Packaging, EMAP. 2006. 4430563 (2006 International Conference on Electronic Materials and Packaging, EMAP).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Electromigration and thermomigration in flip chip solder joints

AU - Tu, K. N.

AU - Huang, Annie

AU - Ouyang, Fan-Yi

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2006

Y1 - 2006

UR - http://www.scopus.com/inward/record.url?scp=51449109012&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-51449109012&origin=recordpage

U2 - 10.1109/EMAP.2006.4430563

DO - 10.1109/EMAP.2006.4430563

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 1424408342

SN - 9781424408344

T3 - 2006 International Conference on Electronic Materials and Packaging, EMAP

BT - 2006 International Conference on Electronic Materials and Packaging, EMAP

T2 - 2006 International Conference on Electronic Materials and Packaging, EMAP

Y2 - 11 December 2006 through 14 December 2006

ER -

Electromigration and thermomigration in flip chip solder joints

Publication series

Conference

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