Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Dinh-Phuc Tran
  • Kuan-Ju Chen
  • Chih Chen
  • Yao-Tsung Chen
  • Stream Chung

Detail(s)

Original languageEnglish
Article number138640
Journal / PublicationElectrochimica Acta
Volume389
Online published21 May 2021
Publication statusPublished - 1 Sep 2021
Externally publishedYes

Abstract

The current study presents a new microstructure of nanotwinned copper (nt-Cu) with slanted columnar grains and its correlated mechanical properties. We deposited such nt-Cu foils via rotary electroplating. These unique nt-Cu foils possess higher tensile strength and ductility than that of straight columnar nt-Cu foils. An incline of slant degree results in the activation of multiple dislocation slip systems, where twin boundaries benefit from the highest strengthening effect of slanted grains. Thus, it leads to greater tensile strength and ductility of our foils compared to the <111>-oriented columnar nt-Cu. Our study presents a promising method to fabricate nt-Cu foils with excellent mechanical strength and ductility.

Research Area(s)

  • Ductility, Nanotwinned copper, Rotary electrodeposition, Slanted columnar grains, Tensile strength

Citation Format(s)

Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility. / Tran, Dinh-Phuc; Chen, Kuan-Ju; Tu, K.N.; Chen, Chih; Chen, Yao-Tsung; Chung, Stream.

In: Electrochimica Acta, Vol. 389, 138640, 01.09.2021.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review