Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility

Dinh-Phuc Tran, Kuan-Ju Chen, K.N. Tu, Chih Chen*, Yao-Tsung Chen, Stream Chung

*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

45 Citations (Scopus)

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Engineering

Material Science