Electrodeposition of Ni-Cu alloy films from nickel matte in deep eutectic solvent

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

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Author(s)

  • Shuaichao Rao
  • Xingli Zou
  • Shujuan Wang
  • Yi Lu
  • Tianyu Shi
  • Qian Xu
  • Xionggang Lu

Detail(s)

Original languageEnglish
Pages (from-to)6-15
Journal / PublicationMaterials Chemistry and Physics
Volume232
Online published23 Apr 2019
Publication statusPublished - 15 Jun 2019

Abstract

Direct electrodeposition of Ni-Cu alloy films from nickel matte precursor in choline chloride (ChCl)/urea (1:2 molar ratio) based deep eutectic solvent (DES) has been investigated. The nickel matte was firstly sintered with KCl at 450 °C for 45 min to form metal chlorides (NiCl2 and CuCl), then the chlorinated nickel matte was dissolved into ChCl/urea DES, which served as electrolyte for the electrodeposition of Ni-Cu alloy films. For comparison, electrodeposition of Ni-Cu alloy films from pure chlorides (NiCl2·6H2O and CuCl) precursors in ChCl/urea DES has also been investigated. Cyclic voltammetry analysis confirms that the two electrodeposition processes in DES are similar, and Ni-Cu alloy films with different compositions can be deposited in a controlled manner. The phase compositions, microstructures and corrosion resistance performances of the two Ni-Cu alloy films electrodeposited from different precursors have also been investigated and compared. It is suggested that the chlorination-electrodeposition process in DES is a promising strategy for the electrochemical extraction of alloys from complex raw materials.

Research Area(s)

  • Deep eutectic solvent, Electrodeposition, Ni-Cu alloy, Nickel matte

Citation Format(s)

Electrodeposition of Ni-Cu alloy films from nickel matte in deep eutectic solvent. / Rao, Shuaichao; Zou, Xingli; Wang, Shujuan; Lu, Yi; Shi, Tianyu; Hsu, Hsien-Yi; Xu, Qian; Lu, Xionggang.

In: Materials Chemistry and Physics, Vol. 232, 15.06.2019, p. 6-15.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review