TY - JOUR
T1 - Electrodeposition of Ni-Cu alloy films from nickel matte in deep eutectic solvent
AU - Rao, Shuaichao
AU - Zou, Xingli
AU - Wang, Shujuan
AU - Lu, Yi
AU - Shi, Tianyu
AU - Hsu, Hsien-Yi
AU - Xu, Qian
AU - Lu, Xionggang
PY - 2019/6/15
Y1 - 2019/6/15
N2 - Direct electrodeposition of Ni-Cu alloy films from nickel matte precursor in choline chloride (ChCl)/urea (1:2 molar ratio) based deep eutectic solvent (DES) has been investigated. The nickel matte was firstly sintered with KCl at 450 °C for 45 min to form metal chlorides (NiCl2 and CuCl), then the chlorinated nickel matte was dissolved into ChCl/urea DES, which served as electrolyte for the electrodeposition of Ni-Cu alloy films. For comparison, electrodeposition of Ni-Cu alloy films from pure chlorides (NiCl2·6H2O and CuCl) precursors in ChCl/urea DES has also been investigated. Cyclic voltammetry analysis confirms that the two electrodeposition processes in DES are similar, and Ni-Cu alloy films with different compositions can be deposited in a controlled manner. The phase compositions, microstructures and corrosion resistance performances of the two Ni-Cu alloy films electrodeposited from different precursors have also been investigated and compared. It is suggested that the chlorination-electrodeposition process in DES is a promising strategy for the electrochemical extraction of alloys from complex raw materials.
AB - Direct electrodeposition of Ni-Cu alloy films from nickel matte precursor in choline chloride (ChCl)/urea (1:2 molar ratio) based deep eutectic solvent (DES) has been investigated. The nickel matte was firstly sintered with KCl at 450 °C for 45 min to form metal chlorides (NiCl2 and CuCl), then the chlorinated nickel matte was dissolved into ChCl/urea DES, which served as electrolyte for the electrodeposition of Ni-Cu alloy films. For comparison, electrodeposition of Ni-Cu alloy films from pure chlorides (NiCl2·6H2O and CuCl) precursors in ChCl/urea DES has also been investigated. Cyclic voltammetry analysis confirms that the two electrodeposition processes in DES are similar, and Ni-Cu alloy films with different compositions can be deposited in a controlled manner. The phase compositions, microstructures and corrosion resistance performances of the two Ni-Cu alloy films electrodeposited from different precursors have also been investigated and compared. It is suggested that the chlorination-electrodeposition process in DES is a promising strategy for the electrochemical extraction of alloys from complex raw materials.
KW - Deep eutectic solvent
KW - Electrodeposition
KW - Ni-Cu alloy
KW - Nickel matte
UR - http://www.scopus.com/inward/record.url?scp=85067277320&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85067277320&origin=recordpage
U2 - 10.1016/j.matchemphys.2019.04.052
DO - 10.1016/j.matchemphys.2019.04.052
M3 - RGC 21 - Publication in refereed journal
SN - 0254-0584
VL - 232
SP - 6
EP - 15
JO - Materials Chemistry and Physics
JF - Materials Chemistry and Physics
ER -