Electrically reversible cracks in an intermetallic film controlled by an electric field

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

15 Scopus Citations
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Author(s)

  • Z. Q. Liu
  • J. H. Liu
  • M. D. Biegalski
  • J. M. Hu
  • S. L. Shang
  • Y. Ji
  • J. M. Wang
  • S. L. Hsu
  • A. T. Wong
  • M. J. Cordill
  • B. Gludovatz
  • C. Marker
  • H. Yan
  • Z. X. Feng
  • L. You
  • M. W. Lin
  • T. Z. Ward
  • Z. K. Liu
  • C. B. Jiang
  • L. Q. Chen
  • H. M. Christen
  • R. Ramesh

Detail(s)

Original languageEnglish
Article number41
Journal / PublicationNature Communications
Volume9
Online published3 Jan 2018
Publication statusPublished - 2018
Externally publishedYes

Abstract

Cracks in solid-state materials are typically irreversible. Here we report electrically reversible opening and closing of nanoscale cracks in an intermetallic thin film grown on a ferroelectric substrate driven by a small electric field (~0.83 kV/cm). Accordingly, a nonvolatile colossal electroresistance on-off ratio of more than 108 is measured across the cracks in the intermetallic film at room temperature. Cracks are easily formed with low-frequency voltage cycling and remain stable when the device is operated at high frequency, which offers intriguing potential for next-generation high-frequency memory applications. Moreover, endurance testing demonstrates that the opening and closing of such cracks can reach over 107 cycles under 10-μs pulses, without catastrophic failure of the film.

Citation Format(s)

Electrically reversible cracks in an intermetallic film controlled by an electric field. / Liu, Z. Q.; Liu, J. H.; Biegalski, M. D.; Hu, J. M.; Shang, S. L.; Ji, Y.; Wang, J. M.; Hsu, S. L.; Wong, A. T.; Cordill, M. J.; Gludovatz, B.; Marker, C.; Yan, H.; Feng, Z. X.; You, L.; Lin, M. W.; Ward, T. Z.; Liu, Z. K.; Jiang, C. B.; Chen, L. Q.; Ritchie, R. O.; Christen, H. M.; Ramesh, R.

In: Nature Communications, Vol. 9, 41, 2018.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review