Electrical characterization of ultra-shallow junctions formed by plasma immersion implantation

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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Author(s)

  • B. L. Yang
  • H. Wong
  • P. G. Han
  • M. C. Poon

Detail(s)

Original languageEnglish
Title of host publicationProceedings of the International Conference on Microelectronics, ICM
PublisherIEEE
Pages429-432
Volume2
Publication statusPublished - 1999
Externally publishedYes

Publication series

Name
Volume2

Conference

Title22nd International Conference on Microelectronics (MEL 2000)
CityNis, Yugoslavia
Period14 - 17 May 2000

Abstract

This work reports some electrical characteristics of ultra-shallow (approx. 90 nm) n+p junctions fabricated using plasma immersion implantation of arsenic ions. Both forward and reverse current-voltage (IV) characteristics at operation temperature ranging from 100 to 450 K were measured. Results show that the ideality factor varies from unity to two indicating both diffusion and GR processes are important in these devices. The ideality factor is found to fluctuate with the temperature, indicating that discrete trap centers exist in these samples. Annealing has profound effect on the reverse diode characteristics. For fully activated sample, the IV relationship essentially follows a power law, i.e I ∝ Vm. The power index m ≈ 3 and almost remains unchanged at different temperatures.

Citation Format(s)

Electrical characterization of ultra-shallow junctions formed by plasma immersion implantation. / Yang, B. L.; Wong, H.; Han, P. G.; Poon, M. C.

Proceedings of the International Conference on Microelectronics, ICM. Vol. 2 IEEE, 1999. p. 429-432.

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review