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Electrical bioadhesive interface for bioelectronics

  • Jue Deng (Co-first Author)
  • , Hyunwoo Yuk (Co-first Author)
  • , Jingjing Wu
  • , Claudia E. Varela
  • , Xiaoyu Chen
  • , Ellen T. Roche
  • , Chuan Fei Guo*
  • , Xuanhe Zhao*
  • *Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Abstract

Reliable functions of bioelectronic devices require conformal, stable and conductive interfaces with biological tissues. Integrating bioelectronic devices with tissues usually relies on physical attachment or surgical suturing; however, these methods face challenges such as non-conformal contact, unstable fixation, tissue damage, and/or scar formation. Here, we report an electrical bioadhesive (e-bioadhesive) interface, based on a thin layer of a graphene nanocomposite, that can provide rapid (adhesion formation within 5 s), robust (interfacial toughness >400 J m−2) and on-demand detachable integration of bioelectronic devices on diverse wet dynamic tissues. The electrical conductivity (>2.6 S m−1) of the e-bioadhesive interface further allows bidirectional bioelectronic communications. We demonstrate biocompatibility, applicability, mechanical and electrical stability, and recording and stimulation functionalities of the e-bioadhesive interface based on ex vivo porcine and in vivo rat models. These findings offer a promising strategy to improve tissue–device integration and enhance the performance of biointegrated electronic devices. © 2020, The Author(s), under exclusive licence to Springer Nature Limited.
Original languageEnglish
Pages (from-to)229-236
JournalNature Materials
Volume20
Issue number2
Online published28 Sept 2020
DOIs
Publication statusPublished - Feb 2021
Externally publishedYes

Funding

We thank C.S. Nabzdyk at Mayo Clinic for the insightful discussions and suggestions, R. Bronson at Harvard Medical School for the histological analyses and D. Yang at MIT for help with the charge injection capacity tests. This work is supported by Centers for Mechanical Engineering Research and Education at MIT and SUSTech (MechERE Centers at MIT and SUSTech), the Innovation Committee of Shenzhen Municipality (JCYJ20170817111714314, C.F.G.), the National Natural Science Foundation of China (numbers U1613204 and 51771089, C.F.G.), the Science Technology the Shenzhen Sci-Tech Fund (KYTDPT20181011104007, C.F.G.) and the Guangdong Innovative and Entrepreneurial Research Team Program (2016ZT06G587, C.F.G.). H.Y. acknowledges financial support from a Samsung Scholarship.

ESI Highly Cited Papers

  • Highly Cited Paper 2026

ESI Highly Cited Paper Designation Date(s)

  • 20260923

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