TY - GEN
T1 - Electric Field Effects on Short-Circuiting between Adjacent Joints in Fine Pitch Anisotropically Conductive Adhesive Interconnections
AU - Chiu, Y.W.
AU - Chan, Y.C.
AU - Lui, S.M.
PY - 2002/5
Y1 - 2002/5
N2 - Anisotropic conductive adhesive films (ACFs) have been extensively used for Chip-On-Glass (COG) applications in the Liquid Crystal Display (LCD) industry. One of the very important performance requirements of using ACFs is not to create electric current leakage between adjacent joints as it may lead to abnormal display segment of the LCD. As this is one of the major concerns to the manufacturers, understanding of the failure mechanism can improve in the product reliability and reduce any economic or resources losses. In this work, the possibility of short-circuiting between adjacent joints in fine pitch ACF interconnections under the effects of electric field was investigated. Insulation resistance measurements of the selected adhesive joints against electric field strength 1V/μm for a 24hrs test duration were discussed and analyzed. The results showed a strong dependence of curing degree of the ACFs on the chance of short-circuiting between adjacent joints under field effects.
AB - Anisotropic conductive adhesive films (ACFs) have been extensively used for Chip-On-Glass (COG) applications in the Liquid Crystal Display (LCD) industry. One of the very important performance requirements of using ACFs is not to create electric current leakage between adjacent joints as it may lead to abnormal display segment of the LCD. As this is one of the major concerns to the manufacturers, understanding of the failure mechanism can improve in the product reliability and reduce any economic or resources losses. In this work, the possibility of short-circuiting between adjacent joints in fine pitch ACF interconnections under the effects of electric field was investigated. Insulation resistance measurements of the selected adhesive joints against electric field strength 1V/μm for a 24hrs test duration were discussed and analyzed. The results showed a strong dependence of curing degree of the ACFs on the chance of short-circuiting between adjacent joints under field effects.
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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0036287042&origin=recordpage
U2 - 10.1109/ECTC.2002.1008246
DO - 10.1109/ECTC.2002.1008246
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 0-7803-7430-4
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1135
EP - 1139
BT - 2002 PROCEEDINGS - 52nd ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE
T2 - 52nd Electronic Components and Technology Conference (ECTC 2002)
Y2 - 28 May 2002 through 31 May 2002
ER -