Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint

Ze Zhu; Yan-Cheong Chan; Fengshun Wu

doi:10.1109/ICEPT.2015.7236561

Effects of ZrO₂ nanoparticles on the mechanical properties of Sn₄₂Bi₅₈ solder joint

Ze Zhu
, Yan-Cheong Chan
, Fengshun Wu

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

6 Citations (Scopus)

Abstract

Lead-free solder has been used to replace toxic lead-containing solder. Sn₄₂Bi₅₈ solder has attracted a lot of attention for its low-cost, low melting temperature. Nanoparticles, such as metallic, nonmetallic and oxidant, have been doped into solders to improve their performance. In this study, we investigated the effect of ZrO₂ nanoparticles on the mechanical properties of Sn₄₂Bi₅₈ solder joints. Firstly, solder balls were made from solder paste by stencil printing and reflow. Next, solder balls were reflowed to form solder joints on Cu pad metalized with Au/Ni layers. Then, solder joints were put into an isothermal aging oven for different aging time. Shear tests were performed to investigate the shear strength of both solder joints subjected to aging time. Scanning electron microscope (SEM) was employed to study microstructure evolution in solder matrix. The results showed that the shear strength of Sn₄₂Bi₅₈ solder joints was reinforced with the incorporation of ZrO₂ nanoparticles. The growth of intermetallic compounds (IMCs) in ZrO₂ doped solder joints was observed to be impeded.

Original language	English
Title of host publication	Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE
Pages	140-143
ISBN (Electronic)	978-1-4673-7999-1
DOIs	https://doi.org/10.1109/ICEPT.2015.7236561
Publication status	Published - Aug 2015
Event	16th International Conference on Electronic Packaging Technology, ICEPT 2015 - Changsha, China Duration: 11 Aug 2015 → 14 Aug 2015

Conference

Conference	16th International Conference on Electronic Packaging Technology, ICEPT 2015
Place	China
City	Changsha
Period	11/08/15 → 14/08/15

Research Keywords

intermetallic compound
lead-free
nanoparticles
shear strength
ZrO2

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10.1109/ICEPT.2015.7236561

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Cite this

@inproceedings{66f8c6a8a4334ad7b428db07d0fcb8fe,

title = "Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint",

abstract = "Lead-free solder has been used to replace toxic lead-containing solder. Sn42Bi58 solder has attracted a lot of attention for its low-cost, low melting temperature. Nanoparticles, such as metallic, nonmetallic and oxidant, have been doped into solders to improve their performance. In this study, we investigated the effect of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joints. Firstly, solder balls were made from solder paste by stencil printing and reflow. Next, solder balls were reflowed to form solder joints on Cu pad metalized with Au/Ni layers. Then, solder joints were put into an isothermal aging oven for different aging time. Shear tests were performed to investigate the shear strength of both solder joints subjected to aging time. Scanning electron microscope (SEM) was employed to study microstructure evolution in solder matrix. The results showed that the shear strength of Sn42Bi58 solder joints was reinforced with the incorporation of ZrO2 nanoparticles. The growth of intermetallic compounds (IMCs) in ZrO2 doped solder joints was observed to be impeded.",

keywords = "intermetallic compound, lead-free, nanoparticles, shear strength, ZrO2",

author = "Ze Zhu and Yan-Cheong Chan and Fengshun Wu",

year = "2015",

month = aug,

doi = "10.1109/ICEPT.2015.7236561",

language = "English",

pages = "140--143",

booktitle = "Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT)",

publisher = "IEEE",

address = "United States",

note = "16th International Conference on Electronic Packaging Technology, ICEPT 2015 ; Conference date: 11-08-2015 Through 14-08-2015",

}

Zhu, Z , Chan, Y-C & Wu, F 2015, Effects of ZrO₂ nanoparticles on the mechanical properties of Sn₄₂Bi₅₈ solder joint. in Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT)., 7236561, IEEE, pp. 140-143, 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11/08/15. https://doi.org/10.1109/ICEPT.2015.7236561

Effects of ZrO₂ nanoparticles on the mechanical properties of Sn₄₂Bi₅₈ solder joint. / Zhu, Ze ; Chan, Yan-Cheong; Wu, Fengshun.
Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2015. p. 140-143 7236561.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint

AU - Zhu, Ze

AU - Chan, Yan-Cheong

AU - Wu, Fengshun

PY - 2015/8

Y1 - 2015/8

N2 - Lead-free solder has been used to replace toxic lead-containing solder. Sn42Bi58 solder has attracted a lot of attention for its low-cost, low melting temperature. Nanoparticles, such as metallic, nonmetallic and oxidant, have been doped into solders to improve their performance. In this study, we investigated the effect of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joints. Firstly, solder balls were made from solder paste by stencil printing and reflow. Next, solder balls were reflowed to form solder joints on Cu pad metalized with Au/Ni layers. Then, solder joints were put into an isothermal aging oven for different aging time. Shear tests were performed to investigate the shear strength of both solder joints subjected to aging time. Scanning electron microscope (SEM) was employed to study microstructure evolution in solder matrix. The results showed that the shear strength of Sn42Bi58 solder joints was reinforced with the incorporation of ZrO2 nanoparticles. The growth of intermetallic compounds (IMCs) in ZrO2 doped solder joints was observed to be impeded.

AB - Lead-free solder has been used to replace toxic lead-containing solder. Sn42Bi58 solder has attracted a lot of attention for its low-cost, low melting temperature. Nanoparticles, such as metallic, nonmetallic and oxidant, have been doped into solders to improve their performance. In this study, we investigated the effect of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joints. Firstly, solder balls were made from solder paste by stencil printing and reflow. Next, solder balls were reflowed to form solder joints on Cu pad metalized with Au/Ni layers. Then, solder joints were put into an isothermal aging oven for different aging time. Shear tests were performed to investigate the shear strength of both solder joints subjected to aging time. Scanning electron microscope (SEM) was employed to study microstructure evolution in solder matrix. The results showed that the shear strength of Sn42Bi58 solder joints was reinforced with the incorporation of ZrO2 nanoparticles. The growth of intermetallic compounds (IMCs) in ZrO2 doped solder joints was observed to be impeded.

KW - intermetallic compound

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KW - shear strength

KW - ZrO2

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BT - Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

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