Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

4 Scopus Citations
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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)3013–3018
Journal / PublicationMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume50
Issue number7
Online published7 May 2019
Publication statusPublished - Jul 2019

Abstract

Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.

Citation Format(s)

Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires. / YANG, Haokun; CAO, Ke; LU, Jian et al.
In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 50, No. 7, 07.2019, p. 3013–3018.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review