Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
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Related Research Unit(s)
Detail(s)
Original language | English |
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Pages (from-to) | 3013–3018 |
Journal / Publication | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science |
Volume | 50 |
Issue number | 7 |
Online published | 7 May 2019 |
Publication status | Published - Jul 2019 |
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Abstract
Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.
Citation Format(s)
Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires. / YANG, Haokun; CAO, Ke; LU, Jian et al.
In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 50, No. 7, 07.2019, p. 3013–3018.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review