Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires

Haokun YANG; Ke CAO; Jian LU; Yang LU

doi:10.1007/s11661-019-05209-w

Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires

Haokun YANG
, Ke CAO
, Jian LU^*
, Yang LU^*

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

8 Citations (Scopus)

Abstract

Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.

Original language	English
Pages (from-to)	3013–3018
Journal	Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume	50
Issue number	7
Online published	7 May 2019
DOIs	https://doi.org/10.1007/s11661-019-05209-w
Publication status	Published - Jul 2019

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title = "Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires",

abstract = "Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.",

author = "Haokun YANG and Ke CAO and Jian LU and Yang LU",

year = "2019",

month = jul,

doi = "10.1007/s11661-019-05209-w",

language = "English",

volume = "50",

pages = "3013–3018",

journal = "Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science",

issn = "1073-5623",

publisher = "Springer Boston",

number = "7",

}

Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires. / YANG, Haokun; CAO, Ke ; LU, Jian et al.
In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 50, No. 7, 07.2019, p. 3013–3018.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

TY - JOUR

T1 - Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires

AU - YANG, Haokun

AU - CAO, Ke

AU - LU, Jian

AU - LU, Yang

PY - 2019/7

Y1 - 2019/7

N2 - Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.

AB - Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.

UR - https://www.scopus.com/pages/publications/85065519488

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85065519488&origin=recordpage

U2 - 10.1007/s11661-019-05209-w

DO - 10.1007/s11661-019-05209-w

M3 - RGC 21 - Publication in refereed journal

SN - 1073-5623

VL - 50

SP - 3013

EP - 3018

JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

IS - 7

ER -

Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires

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GRF: Nanomechanics of Ultrathin Metallic Nanowires and Their Scalable Assembly

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Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires

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GRF: Nanomechanics of Ultrathin Metallic Nanowires and Their Scalable Assembly

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