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EFFECTS OF ION SPECIES AND ADSORBED GAS ON DRY ETCHING INDUCED DAMAGE IN GaAs.

  • S. W. Pang
  • , M. W. Geis
  • , N. N. Efremow
  • , G. A. Lincoln

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

Abstract

Damage induced in GaAs by ion-beam etching and ion-beam-assisted etching was found to be affected by ion energy, ion mass, and adsorbed gas on the sample surfaces during etching. The etching characteristics of Ne, Ar, and Xe ions with energies ranging from 250 to 2000 ev were studied. The effect of gas adsorption was investigated by using Cl//2 (reactive gas for GaAs) and NO//2 (nonreactive gas for GaAs) with gas fluxes equivalent to pressures between 2 and 50 multiplied by 10** minus **4 Torr. Dry etching induced damage was evaluated by measuring electrical characteristics of Schottky diodes fabricated on the etched GaAs surfaces. The results indicated that damage in GaAs can be minimized by reducing the ion penetration distance into the substrate by using low ion energy and heavy ion species, and by introducing adsorbed gas, such as Cl//2 or NO//2, on the sample surface as a protective layer.
Original languageEnglish
Title of host publicationProceedings Of The 1984 International Symposium On Electron, Ion, And Photon Beams, 29 May - 1 June 1984, Tarrytown, N.Y
Pages398-401
Volume3
DOIs
Publication statusPublished - Jan 1984
Externally publishedYes
EventProc of the 1984 Int Symp on Electron, Ion, and Photon Beams - Tarrytown, NY, USA
Duration: 29 May 19841 Jun 1984

Publication series

NameJournal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena
Volume3
ISSN (Electronic)0734-211X

Conference

ConferenceProc of the 1984 Int Symp on Electron, Ion, and Photon Beams
CityTarrytown, NY, USA
Period29/05/841/06/84

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