Effects of interinetallic compounds on properties of Sn-Cu lead-free soldered joints

M. N. Islam; Y. C. Chan; M. O. Alam

doi:10.1109/AGEC.2005.1452342

Effects of interinetallic compounds on properties of Sn-Cu lead-free soldered joints

M. N. Islam, Y. C. Chan, M. O. Alam

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

2 Citations (Scopus)

Abstract

The environmentally conscious manufacturer is moving toward 'green products' for electronic devices and components. In this paper we investigate the interfacial reactions of Sn0.7Cu solder on electrolytic Ni layer for extended times reflow. It is found that during as-reflowed, the formation of Cu-rich Sn-Cu-Ni ternary intermetallic compounds (TIMCs) at the interface of Sn0.7Cu solder with electrolytic Ni is much quicker, resulting in the entrapment of some Pb (which is present (about 0.02wt%) as impurity in the Sn-Cu solder) rich phase in the TIMCs. During extended time of reflow, high (>30at %), medium (30-15at %) and low (

Original language	English
Title of host publication	Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
Pages	185-191
Volume	2005
DOIs	https://doi.org/10.1109/AGEC.2005.1452342
Publication status	Published - 2005
Event	2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC - Shanghai, China Duration: 15 Mar 2005 → 18 Mar 2005

Publication series

Name
Volume	2005

Conference

Conference	2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
Place	China
City	Shanghai
Period	15/03/05 → 18/03/05

Access Output

10.1109/AGEC.2005.1452342

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@inproceedings{a71046a907ec428c8d834046673c4d75,

title = "Effects of interinetallic compounds on properties of Sn-Cu lead-free soldered joints",

abstract = "The environmentally conscious manufacturer is moving toward 'green products' for electronic devices and components. In this paper we investigate the interfacial reactions of Sn0.7Cu solder on electrolytic Ni layer for extended times reflow. It is found that during as-reflowed, the formation of Cu-rich Sn-Cu-Ni ternary intermetallic compounds (TIMCs) at the interface of Sn0.7Cu solder with electrolytic Ni is much quicker, resulting in the entrapment of some Pb (which is present (about 0.02wt%) as impurity in the Sn-Cu solder) rich phase in the TIMCs. During extended time of reflow, high (>30at %), medium (30-15at %) and low (",

author = "Islam, {M. N.} and Chan, {Y. C.} and Alam, {M. O.}",

year = "2005",

doi = "10.1109/AGEC.2005.1452342",

language = "English",

volume = "2005",

pages = "185--191",

booktitle = "Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC",

note = "2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC ; Conference date: 15-03-2005 Through 18-03-2005",

}

Islam, MN, Chan, YC & Alam, MO 2005, Effects of interinetallic compounds on properties of Sn-Cu lead-free soldered joints. in Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC. vol. 2005, 1452342, pp. 185-191, 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, Shanghai, China, 15/03/05. https://doi.org/10.1109/AGEC.2005.1452342

Effects of interinetallic compounds on properties of Sn-Cu lead-free soldered joints. / Islam, M. N.; Chan, Y. C.; Alam, M. O.
Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC. Vol. 2005 2005. p. 185-191 1452342.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Effects of interinetallic compounds on properties of Sn-Cu lead-free soldered joints

AU - Islam, M. N.

AU - Chan, Y. C.

AU - Alam, M. O.

PY - 2005

Y1 - 2005

N2 - The environmentally conscious manufacturer is moving toward 'green products' for electronic devices and components. In this paper we investigate the interfacial reactions of Sn0.7Cu solder on electrolytic Ni layer for extended times reflow. It is found that during as-reflowed, the formation of Cu-rich Sn-Cu-Ni ternary intermetallic compounds (TIMCs) at the interface of Sn0.7Cu solder with electrolytic Ni is much quicker, resulting in the entrapment of some Pb (which is present (about 0.02wt%) as impurity in the Sn-Cu solder) rich phase in the TIMCs. During extended time of reflow, high (>30at %), medium (30-15at %) and low (

AB - The environmentally conscious manufacturer is moving toward 'green products' for electronic devices and components. In this paper we investigate the interfacial reactions of Sn0.7Cu solder on electrolytic Ni layer for extended times reflow. It is found that during as-reflowed, the formation of Cu-rich Sn-Cu-Ni ternary intermetallic compounds (TIMCs) at the interface of Sn0.7Cu solder with electrolytic Ni is much quicker, resulting in the entrapment of some Pb (which is present (about 0.02wt%) as impurity in the Sn-Cu solder) rich phase in the TIMCs. During extended time of reflow, high (>30at %), medium (30-15at %) and low (

UR - http://www.scopus.com/inward/record.url?scp=33745009025&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-33745009025&origin=recordpage

U2 - 10.1109/AGEC.2005.1452342

DO - 10.1109/AGEC.2005.1452342

M3 - RGC 32 - Refereed conference paper (with host publication)

VL - 2005

SP - 185

EP - 191

BT - Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC

T2 - 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC

Y2 - 15 March 2005 through 18 March 2005

ER -

Effects of interinetallic compounds on properties of Sn-Cu lead-free soldered joints

Abstract

Publication series

Conference

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this