TY - GEN
T1 - Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature
AU - Nah, J. W.
AU - Suh, J. O.
AU - Paik, K. W.
AU - Tu, K. N.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2005
Y1 - 2005
N2 - The electromigration of flip chip solder joints consisting of 97Pb-3Sn and 37Pb-63Sn composite solders was studied under high current densities at room temperature. The MTTF (Mean Time to Failure) and failure modes were found to be strongly dependant on the change of current density. The composite solder joints did not failed after one month stressed at 4.07 × 10 4 A/cm 2, but they failed after 10 hours of current stressing at 4.58 × 10 4 A/cm 2. At a slightly higher current stressing of 5.00 × 10 4 A/cm 2, they failed after only 0.6 hours by the melting of the composite solder bumps. Due to the precipitation and growth of Cu 6Sn 5 intermetallic compound at the cathode side, the Cu Under Bump Metallurgy (UBM) was quickly consumed and followed by void formation at the contact area. The void reduced the contact area and displaced the electrical path, thus it affects greatly the current crowding and Joule heating inside the solder bump. A large Joule heating inside solder bumps can cause melting of the solder bump and the failure occurred quickly. The effect of void propagation on current crowding and Joule heating has been confirmed by simulation. © 2005 IEEE.
AB - The electromigration of flip chip solder joints consisting of 97Pb-3Sn and 37Pb-63Sn composite solders was studied under high current densities at room temperature. The MTTF (Mean Time to Failure) and failure modes were found to be strongly dependant on the change of current density. The composite solder joints did not failed after one month stressed at 4.07 × 10 4 A/cm 2, but they failed after 10 hours of current stressing at 4.58 × 10 4 A/cm 2. At a slightly higher current stressing of 5.00 × 10 4 A/cm 2, they failed after only 0.6 hours by the melting of the composite solder bumps. Due to the precipitation and growth of Cu 6Sn 5 intermetallic compound at the cathode side, the Cu Under Bump Metallurgy (UBM) was quickly consumed and followed by void formation at the contact area. The void reduced the contact area and displaced the electrical path, thus it affects greatly the current crowding and Joule heating inside the solder bump. A large Joule heating inside solder bumps can cause melting of the solder bump and the failure occurred quickly. The effect of void propagation on current crowding and Joule heating has been confirmed by simulation. © 2005 IEEE.
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U2 - 10.1109/ISAPM.2005.1432044
DO - 10.1109/ISAPM.2005.1432044
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 0780390857
SN - 9780780390850
VL - 2005
T3 - Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
SP - 50
EP - 53
BT - Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
T2 - 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Y2 - 16 March 2005 through 18 March 2005
ER -