Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface
- D. Q. Yu
- , C.M. Lawrence Wu
- , D. P. He
- , N. Zhao
- , L. Wang
- , J. K L Lai
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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