Effects of contact resistance and film thickness on current crowding and the critical product of electromigration in Blech structures

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

15 Scopus Citations
View graph of relations

Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)3203-3208
Journal / PublicationJournal of Applied Physics
Volume89
Issue number6
Publication statusPublished - 15 Mar 2001
Externally publishedYes

Abstract

In using Blech structures to study electromigration, the current density has been assumed to be the same in similar sets of short strips deposited on an underlayer. But this is not true owing to the existence of contact resistance between the strips and the underlayer. The contact resistivity may change due to different methods of sample preparation. High contact resistivity reduces the maximum current in the strip. Also, it diffuses the currents at the strip/underlayer interface from a narrow crowding to a wide spreading. In this work, we simulate these phenomena of current reduction and spreading in terms of contact resistivity and film thickness. We explore their effects on back stress and incubation time of void formation in short strips. We demonstrate these effects by the discrepancy in the critical product measurements found in experiments using similar Blech structures. © 2001 American Institute of Physics.

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to lbscholars@cityu.edu.hk.