Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip-chip on flex application

Jianhua Zhang; Y. C. Chan

doi:10.1109/HPD.2004.1346711

Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip-chip on flex application

Jianhua Zhang
, Y. C. Chan^*

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

6 Citations (Scopus)

Abstract

Although there have been many years of development, the reliability of the electrical performance of anisotropically conductive adhesives or films (ACAs or ACFs) interconnection for flip chip assembly is still a critical drawback despite wide application. In-depth study about the reliability and degradation mechanism of ACF interconnection is necessary. In this paper, effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip chip on flex substrate was investigated using different bump/pad meatalizations couple. Contact resistance changes were monitored during reliability tests such as high humidity and temperature, and thermal cycling. Both the higher initial contact resistance and rapiad increment were investigated in ACF assemblies with Ni-Cu coupled metallization. The potential causes for the bigger degradation of Ni-Cu coupled ACF were analysed. © 2004 IEEE.

Original language	English
Title of host publication	Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
Publisher	IEEE
Pages	277-281
ISBN (Print)	0780386205, 9780780386204
DOIs	https://doi.org/10.1109/HPD.2004.1346711
Publication status	Published - 2004
Event	6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04) - Bao Long Hotel, Shanghai, China Duration: 30 Jun 2004 → 3 Jul 2004

Conference

Conference	6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04)
Place	China
City	Shanghai
Period	30/06/04 → 3/07/04

Research Keywords

Anisotropically conductive adhesive or film
Contact resistance
Degradation mechanism
Flip chip
Reliability

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10.1109/HPD.2004.1346711

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@inproceedings{c46926fdab7548e4bcebb4cfb9fb5338,

title = "Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip-chip on flex application",

abstract = "Although there have been many years of development, the reliability of the electrical performance of anisotropically conductive adhesives or films (ACAs or ACFs) interconnection for flip chip assembly is still a critical drawback despite wide application. In-depth study about the reliability and degradation mechanism of ACF interconnection is necessary. In this paper, effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip chip on flex substrate was investigated using different bump/pad meatalizations couple. Contact resistance changes were monitored during reliability tests such as high humidity and temperature, and thermal cycling. Both the higher initial contact resistance and rapiad increment were investigated in ACF assemblies with Ni-Cu coupled metallization. The potential causes for the bigger degradation of Ni-Cu coupled ACF were analysed. {\textcopyright} 2004 IEEE.",

keywords = "Anisotropically conductive adhesive or film, Contact resistance, Degradation mechanism, Flip chip, Reliability",

author = "Jianhua Zhang and Chan, \{Y. C.\}",

year = "2004",

doi = "10.1109/HPD.2004.1346711",

language = "English",

isbn = "0780386205",

pages = "277--281",

booktitle = "Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis",

publisher = "IEEE",

address = "United States",

note = "6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04) ; Conference date: 30-06-2004 Through 03-07-2004",

}

Zhang, J & Chan, YC 2004, Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip-chip on flex application. in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, pp. 277-281, 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04), Shanghai, China, 30/06/04. https://doi.org/10.1109/HPD.2004.1346711

Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip-chip on flex application. / Zhang, Jianhua; Chan, Y. C.
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, 2004. p. 277-281.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip-chip on flex application

AU - Zhang, Jianhua

AU - Chan, Y. C.

PY - 2004

Y1 - 2004

N2 - Although there have been many years of development, the reliability of the electrical performance of anisotropically conductive adhesives or films (ACAs or ACFs) interconnection for flip chip assembly is still a critical drawback despite wide application. In-depth study about the reliability and degradation mechanism of ACF interconnection is necessary. In this paper, effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip chip on flex substrate was investigated using different bump/pad meatalizations couple. Contact resistance changes were monitored during reliability tests such as high humidity and temperature, and thermal cycling. Both the higher initial contact resistance and rapiad increment were investigated in ACF assemblies with Ni-Cu coupled metallization. The potential causes for the bigger degradation of Ni-Cu coupled ACF were analysed. © 2004 IEEE.

AB - Although there have been many years of development, the reliability of the electrical performance of anisotropically conductive adhesives or films (ACAs or ACFs) interconnection for flip chip assembly is still a critical drawback despite wide application. In-depth study about the reliability and degradation mechanism of ACF interconnection is necessary. In this paper, effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip chip on flex substrate was investigated using different bump/pad meatalizations couple. Contact resistance changes were monitored during reliability tests such as high humidity and temperature, and thermal cycling. Both the higher initial contact resistance and rapiad increment were investigated in ACF assemblies with Ni-Cu coupled metallization. The potential causes for the bigger degradation of Ni-Cu coupled ACF were analysed. © 2004 IEEE.

KW - Anisotropically conductive adhesive or film

KW - Contact resistance

KW - Degradation mechanism

KW - Flip chip

KW - Reliability

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U2 - 10.1109/HPD.2004.1346711

DO - 10.1109/HPD.2004.1346711

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 0780386205

SN - 9780780386204

SP - 277

EP - 281

BT - Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

PB - IEEE

T2 - 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04)

Y2 - 30 June 2004 through 3 July 2004

ER -

Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip-chip on flex application

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