Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

The effects of different bonding pressure during flip-chip-on-flex (FCOF) assembly in relation to the performance of anisotropic conductive film (ACF) interconnect were investigated. Two types of ACF were used in this study. ACF 1 is designed to create good interconnection when the connecting bumps and pads are in close contact while ACF 2 can give good connections when the conductive particles are in contact with the bumps and pads, hence the deformation of conductive particles within ACF 2 FCOF packages were less than that within ACF 1 packages. ACF 2 gave much better interconnection performance when compared to ACF 1 indicating that ACF 2 is more flexible and can tolerate a wider range of bonding pressure. © 2002 Published by Elsevier Science Ltd.