Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Quan-Zhang An
  • Kai Feng
  • He-Ping Lü
  • Xun Cai
  • Tie-Tun Sun

Detail(s)

Original languageEnglish
Pages (from-to)1944-1949
Journal / PublicationTransactions of Nonferrous Metals Society of China (English Edition)
Volume25
Issue number6
Publication statusPublished - 1 Jun 2015

Abstract

Al and N were introduced into copper substrate using plasma immersion ion implantation (PIII) in order to enhance its hardness and oxidation resistance. The dosage of N ion is 5×1016 cm-2, and range of dosage of Al ion is 5×1016-2×1017 cm-2. The oxidation tests indicate that the copper samples after undergoing PIII possess higher oxidation resistance. The degree of oxidation resistance is found to vary with implantation dosage of Al ion. The antibacterial tests also reveal that the plasma implanted copper specimens have excellent antibacterial resistance against Staphylococcus aureus, which are similar to pure copper.

Research Area(s)

  • antibacterial properties, copper, nanoindentation, oxidation resistance, plasma immersion ion implantation

Citation Format(s)

Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu. / An, Quan-Zhang; Feng, Kai; Lü, He-Ping; Cai, Xun; Sun, Tie-Tun; Chu, Paul K.

In: Transactions of Nonferrous Metals Society of China (English Edition), Vol. 25, No. 6, 01.06.2015, p. 1944-1949.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review