Effects and mechanisms of nitrogen incorporation into hafnium oxide by plasma immersion implantation

Hei Wong, Banani Sen, B. L. Yang, A. P. Huang, P. K. Chu

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

21 Citations (Scopus)

Abstract

The physics and effects of nitrogen incorporation into Hf O2 films were studied in detail. The authors found that only a trace amount (∼5%) of nitrogen can be introduced into the Hf O2 films using plasma immersion ion-implantation technique, regardless of implantation dose. They proposed that the nitrogen incorporation is due to the filling of O vacancies (VO) and replacement of VO O neighbors in the bulk with nitrogen atoms. At the interface, the nitrogen atoms exist in the form of Hf-N and Si-N bonding, which significantly improve the interface properties of the Hf O2 Si structure. Temperature-dependent capacitance-voltage characteristics measurements indicate that both interface and oxide trap densities were greatly reduced with the incorporation of trace amount of nitrogen atoms. © 2007 American Vacuum Society.
Original languageEnglish
Pages (from-to)1853-1858
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume25
Issue number6
DOIs
Publication statusPublished - 2007

Fingerprint

Dive into the research topics of 'Effects and mechanisms of nitrogen incorporation into hafnium oxide by plasma immersion implantation'. Together they form a unique fingerprint.

Cite this