Abstract
The physics and effects of nitrogen incorporation into Hf O2 films were studied in detail. The authors found that only a trace amount (∼5%) of nitrogen can be introduced into the Hf O2 films using plasma immersion ion-implantation technique, regardless of implantation dose. They proposed that the nitrogen incorporation is due to the filling of O vacancies (VO) and replacement of VO O neighbors in the bulk with nitrogen atoms. At the interface, the nitrogen atoms exist in the form of Hf-N and Si-N bonding, which significantly improve the interface properties of the Hf O2 Si structure. Temperature-dependent capacitance-voltage characteristics measurements indicate that both interface and oxide trap densities were greatly reduced with the incorporation of trace amount of nitrogen atoms. © 2007 American Vacuum Society.
Original language | English |
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Pages (from-to) | 1853-1858 |
Journal | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
Volume | 25 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2007 |