Abstract
The different composition in 42Sn58Bi and 96.5Sn3.5Ag system has been studied. The reflow conditions of various composition pastes were studied, and a suitable adding of Sn-Ag paste could raise the soldering temperature of paste. It was found that the shear tensile strength of solder joint could be improved after adding suitable Sn-Ag to Sn-Bi paste by testing the solder joint tension. The thermal fatigue properties were studied through performed thermal annealing and thermal shocking. The shear tensile strength of solder joints for adding suitable Sn-Ag is higher than the pure Sn-Bi after thermal shocking. The solder property, mechanical and fatigue failure properties of solder joint for adding suitable Sn-Ag could be improved. It was found that suitable Sn-Ag could decrease the porosity in Sn-Bi solder joint thought X-ray and SEM analysis.
| Original language | English |
|---|---|
| Pages (from-to) | 281-283 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 4077 |
| Online published | 9 May 2000 |
| DOIs | |
| Publication status | Published - 2000 |
| Event | International Conference on Sensors and Control Techniques (ICSC 2000) - Wuhan, China Duration: 19 Jun 2000 → 21 Jun 2000 |
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