Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0Ag-0.5Cu solder alloy

I. Shafiq, H. Y. Lau, Y. C. Chan

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

9 Citations (Scopus)

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Engineering

Material Science