Effect of TiO2 addition concentration on the wettability and intermetallic compounds growth of Sn3.0Ag0.5Cu-xTiO2 nano-composite solders
- Yi Li
- , Xiuchen Zhao
- , Ying Liu
- , Yuan Wang
- , Yong Wang
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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(Scopus)