Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

S. W. Liang; Y. W. Chang; T. L. Shao; Chih Chen; K. N. Tu

doi:10.1063/1.2220550

Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

S. W. Liang, Y. W. Chang, T. L. Shao, Chih Chen, K. N. Tu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

63 Citations (Scopus)

Abstract

Effect of three-dimensional current distribution on void formation in flip-chip solder joints during electromigration was investigated using thermoelectrical coupled modeling, in which the current and temperature redistributions were coupled and simulated at different stages of void growth. Simulation results show that a thin underbump metallization of low resistance in the periphery of the solder joint can serve as a conducting path, leading to void propagation in the periphery of the low current density region. In addition, the temperature of the solder did not rise significantly until 95% of the contact opening was eclipsed by the propagating void. © 2006 American Institute of Physics.

Original language	English
Article number	022117
Journal	Applied Physics Letters
Volume	89
Issue number	2
DOIs	https://doi.org/10.1063/1.2220550
Publication status	Published - 2006
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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@article{55862881fad741cfb21d2b408dae8ad5,

title = "Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration",

abstract = "Effect of three-dimensional current distribution on void formation in flip-chip solder joints during electromigration was investigated using thermoelectrical coupled modeling, in which the current and temperature redistributions were coupled and simulated at different stages of void growth. Simulation results show that a thin underbump metallization of low resistance in the periphery of the solder joint can serve as a conducting path, leading to void propagation in the periphery of the low current density region. In addition, the temperature of the solder did not rise significantly until 95% of the contact opening was eclipsed by the propagating void. {\textcopyright} 2006 American Institute of Physics.",

author = "Liang, {S. W.} and Chang, {Y. W.} and Shao, {T. L.} and Chih Chen and Tu, {K. N.}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

year = "2006",

doi = "10.1063/1.2220550",

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journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics",

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TY - JOUR

T1 - Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

AU - Liang, S. W.

AU - Chang, Y. W.

AU - Shao, T. L.

AU - Chen, Chih

AU - Tu, K. N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2006

Y1 - 2006

N2 - Effect of three-dimensional current distribution on void formation in flip-chip solder joints during electromigration was investigated using thermoelectrical coupled modeling, in which the current and temperature redistributions were coupled and simulated at different stages of void growth. Simulation results show that a thin underbump metallization of low resistance in the periphery of the solder joint can serve as a conducting path, leading to void propagation in the periphery of the low current density region. In addition, the temperature of the solder did not rise significantly until 95% of the contact opening was eclipsed by the propagating void. © 2006 American Institute of Physics.

AB - Effect of three-dimensional current distribution on void formation in flip-chip solder joints during electromigration was investigated using thermoelectrical coupled modeling, in which the current and temperature redistributions were coupled and simulated at different stages of void growth. Simulation results show that a thin underbump metallization of low resistance in the periphery of the solder joint can serve as a conducting path, leading to void propagation in the periphery of the low current density region. In addition, the temperature of the solder did not rise significantly until 95% of the contact opening was eclipsed by the propagating void. © 2006 American Institute of Physics.

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DO - 10.1063/1.2220550

M3 - RGC 21 - Publication in refereed journal

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VL - 89

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 2

M1 - 022117

ER -

Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

Abstract

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