TY - JOUR
T1 - Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
AU - Zhu, Ze
AU - Chan, Yan-Cheong
AU - Chen, Zhong
AU - Gan, Chee-Lip
AU - Wu, Fengshun
PY - 2018/6/6
Y1 - 2018/6/6
N2 - Carbon nanotubes (CNTs) with three different diameter ranges (10–20, 40–60, and 60–100 nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the composite SAC-CNTs solder materials – as well as the effect of the size of the CNTs. It was found that all the CNTs-doped composite solder samples displayed refined microstructure, inhibited interfacial intermetallic compound (IMC) growth, and reinforced mechanical strength – while the melting point of the composite solder was close to that of the pristine solder. The reinforcement in mechanical strength was due to the doped CNTs pinned at the solder grain boundaries, which acted as second-phase particles that refined the microstructure and increased the dislocation density. The adsorbed CNTs destroyed the integrity of the interfacial IMCs, leading to reduced growth rate. Among these composite solders, CNTs with a diameter of 40–60 nm provided superior performance in refining the microstructure, lowering the IMC growth rate by 30.9% – and reinforcing the ball shear strength by 15.3% and the hardness by 16.1%. This size effect on the performance of composite solders was due to the various surface energy values for CNTs – that led to the agglomeration and adsorption of CNTs in the solder matrix and interfacial IMCs.
AB - Carbon nanotubes (CNTs) with three different diameter ranges (10–20, 40–60, and 60–100 nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the composite SAC-CNTs solder materials – as well as the effect of the size of the CNTs. It was found that all the CNTs-doped composite solder samples displayed refined microstructure, inhibited interfacial intermetallic compound (IMC) growth, and reinforced mechanical strength – while the melting point of the composite solder was close to that of the pristine solder. The reinforcement in mechanical strength was due to the doped CNTs pinned at the solder grain boundaries, which acted as second-phase particles that refined the microstructure and increased the dislocation density. The adsorbed CNTs destroyed the integrity of the interfacial IMCs, leading to reduced growth rate. Among these composite solders, CNTs with a diameter of 40–60 nm provided superior performance in refining the microstructure, lowering the IMC growth rate by 30.9% – and reinforcing the ball shear strength by 15.3% and the hardness by 16.1%. This size effect on the performance of composite solders was due to the various surface energy values for CNTs – that led to the agglomeration and adsorption of CNTs in the solder matrix and interfacial IMCs.
KW - Solder joints
KW - Carbon nanotubes (CNTs)
KW - Nanodoping
KW - Intermetallic compounds (IMCs)
KW - Microstructure
KW - Mechanical strength
UR - http://www.scopus.com/inward/record.url?scp=85046633158&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85046633158&origin=recordpage
U2 - 10.1016/j.msea.2018.05.002
DO - 10.1016/j.msea.2018.05.002
M3 - RGC 21 - Publication in refereed journal
SN - 0921-5093
VL - 727
SP - 160
EP - 169
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
ER -