TY - GEN
T1 - Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions
AU - Gaina, Asit Kumar
AU - Chan, Y. C.
AU - Sharif, Ahmed
AU - Yung, Winco K. C.
PY - 2009
Y1 - 2009
N2 - Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles and aging time. In the solder ball region, fine acicularshaped Zn-rich phase and spherical-shaped AgZn3 compound particles were found in β-Sn matrix. The shear strength of monolithic Sn-Zn-Bi and 7wt% Sn-Ag-Cu content Sn-Zn-Bi solder joints after one reflow cycle were about 44.5MPa and 53.1MPa, respectively while their shear strengths after eight reflow cycles were about 43.4MPa and 51.6MPa, respectively. The fracture surface of monolithic Sn-Zn-Bi solder exhibited a semi ductile fracture mode with a smooth surface while Sn-Zn-Bi solder joints containing Sn-Ag-Cu particles showed a typical ductile failure with very rough dimpled surfaces. © 2009 IEEE.
AB - Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles and aging time. In the solder ball region, fine acicularshaped Zn-rich phase and spherical-shaped AgZn3 compound particles were found in β-Sn matrix. The shear strength of monolithic Sn-Zn-Bi and 7wt% Sn-Ag-Cu content Sn-Zn-Bi solder joints after one reflow cycle were about 44.5MPa and 53.1MPa, respectively while their shear strengths after eight reflow cycles were about 43.4MPa and 51.6MPa, respectively. The fracture surface of monolithic Sn-Zn-Bi solder exhibited a semi ductile fracture mode with a smooth surface while Sn-Zn-Bi solder joints containing Sn-Ag-Cu particles showed a typical ductile failure with very rough dimpled surfaces. © 2009 IEEE.
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U2 - 10.1109/ECTC.2009.5074137
DO - 10.1109/ECTC.2009.5074137
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 9781424444762
SP - 1021
EP - 1026
BT - Proceedings - Electronic Components and Technology Conference
T2 - 59th Electronic Components and Technology Conference (ECTC 2009)
Y2 - 26 May 2009 through 29 May 2009
ER -