TY - GEN
T1 - Effect of Sidewall Morphology on the Fracture and Fatigue Properties of Polysilicon Structural Films
AU - Alsem, D. H.
AU - Boyce, B. L.
AU - Stach, E. A.
AU - Ritchie, R. O.
PY - 2009/7
Y1 - 2009/7
N2 - This study highlights the difference in the sidewall morphology of n+-type polysilicon films from two popular microelectromechanical systems (MEMS) processes and its effect on fracture and fatigue properties. Atomic force and transmission electron microscopy show that thick silicon oxides (20 ± 5 nm) are found in PolyMUMPs films, caused by galvanic corrosion from the presence of gold on the chip, whereas in SUMMiT films a much thinner (3.5 ± 1.0 nm) native oxide was observed. These thicker oxide layers, in combination with differences in sidewall roughness (14 ± 5 nm for PolyMUMPs and 10 ± 2 nm for SUMMiT), have a significant effect on the fracture and fatigue properties of polysilicon structures; this is shown by measuring fracture strength (3.8 ± 0.3 GPa for PolyMUMPs and 4.8 ± 0.2 GPa for SUMMiT) and stress-lifetime high-cyclic fatigue curves.
AB - This study highlights the difference in the sidewall morphology of n+-type polysilicon films from two popular microelectromechanical systems (MEMS) processes and its effect on fracture and fatigue properties. Atomic force and transmission electron microscopy show that thick silicon oxides (20 ± 5 nm) are found in PolyMUMPs films, caused by galvanic corrosion from the presence of gold on the chip, whereas in SUMMiT films a much thinner (3.5 ± 1.0 nm) native oxide was observed. These thicker oxide layers, in combination with differences in sidewall roughness (14 ± 5 nm for PolyMUMPs and 10 ± 2 nm for SUMMiT), have a significant effect on the fracture and fatigue properties of polysilicon structures; this is shown by measuring fracture strength (3.8 ± 0.3 GPa for PolyMUMPs and 4.8 ± 0.2 GPa for SUMMiT) and stress-lifetime high-cyclic fatigue curves.
UR - https://www.scopus.com/pages/publications/84869794948
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84869794948&origin=recordpage
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 9781617382277
VL - 5
T3 - International Congress on Fracture (ICF)
SP - 4051
EP - 4060
BT - 12th International Conference on Fracture 2009 (ICF-12)
PB - International Conference on Fracture
T2 - 12th International Conference on Fracture 2009 (ICF-12)
Y2 - 12 July 2009 through 17 July 2009
ER -