Abstract
The shear strength (shear break force) of the plastic ball grid array (PBGA) assembly solder joint formed in different reflow profiles is investigated in this paper. It is found that the preheat time of the reflow profile has a great effect on the shear strength of PBGA solder joint, and the best preheat time to achieve the maximum solder joint shear strength is close to 120s. The PBGA solder joint geometry formed in different reflow preheat time is also scrutinized hereinafter. The preheat time has a crucial effect on the geometry of PBGA solder joint. Since the break usually occurs at the weakest point of the solder joint, the solder joint geometry has a close relationship with its shear strength. The resistance of the PBGA daisy chains (solder joints) is also inspected in this paper. The result shows that the smaller the resistance, the seater the shear strength. This is the first time to reveal the relationship between the solder joint shear strength and its resistance.
| Original language | English |
|---|---|
| Pages (from-to) | 264-268 |
| Journal | Proceedings of the Electronic Packaging Technology Conference, EPTC |
| DOIs | |
| Publication status | Published - 1998 |
| Event | Proceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98) - Singapore, Singapore Duration: 8 Dec 1998 → 10 Dec 1998 |
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