Effect of polyimide baking on bump resistance in flip-chip solder joints
- Hsi-Kuei Cheng
- , Shien-Ping Feng
- , Yi-Jen Lai
- , Kuo-Chio Liu
- , Ying-Lang Wang
- , Tzeng-Feng Liu
- , Chih-Ming Chen
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
8
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(Scopus)