Abstract
The effect of polyimide (PI) thermal process on the bump resistance of flip-chip solder joint is investigated for 28 nm technology device with aggressive extreme low-k (ELK) dielectric film scheme and lead-free solder. Kelvin structure is designed in the bump array to measure the resistance of single solder bump. An additional low-temperature pre-baking before standard PI curing increases the bump resistance from 9.3 mΩ to 225 mΩ. The bump resistance increment is well explained by a PI outgassing model established based on the results of Gas Chromatography-Mass Spectrophotometer (GC-MS) analysis. The PI outgassing substances re-deposit on the Al bump pad, increasing the resistance of interface between under-bump metallurgy (UBM) and underneath Al pad. The resistance of interface is twenty-times higher than pure solder bump, which dominates the measured value of bump resistance. Low-temperature plasma etching prior to UBM deposition is proposed to retard the PI outgassing, and it effectively reduces the bump resistance from 225 mΩ to 10.8 mΩ. © 2013 Elsevier Ltd. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 629-632 |
| Journal | Microelectronics Reliability |
| Volume | 54 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - Mar 2014 |
| Externally published | Yes |
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