Effect of pad shape on electromigration in solder bump joints

Yi Li; Y. C. Chan; Xiuchen Zhao

doi:10.1109/ESTC.2014.6962849

Effect of pad shape on electromigration in solder bump joints

Yi Li
, Y. C. Chan^*
, Xiuchen Zhao

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

2 Citations (Scopus)

Abstract

In this study, the effect of pad shape on current density and temperature distributions in solder joints has been investigated by three dimensional thermo-electrical finite element analysis. The simulation results show that square, hexagonal, octagonal and rounded pads with the same thickness/volume generate different current density and temperature distributions. The maximum current densities in solder bumps are 2.81×10⁴, 2.62×10⁴, 2.60×10⁴ and 2.66×10⁴ A/cm² respectively, while the maximum temperatures are 183.3, 181.5, 181.2 and 182.2°C respectively. Solder joints with octagonal pads generate the smallest current density and temperature, indicating that this geometry has the best electromigration reliability. The results indicate that electromigration reliability can be improved by changing pad shape, without enlarging joint size. Pad shape design is a promising solder joint structure design method for enhancement of electromigration reliability in line with the miniaturization trends of future electronic products. Better design of the pad structure should help alleviate the electromigration reliability problem.

Original language	English
Title of host publication	Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
Publisher	IEEE
ISBN (Print)	9781479940264
DOIs	https://doi.org/10.1109/ESTC.2014.6962849
Publication status	Published - 18 Nov 2014
Event	5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki, Finland Duration: 16 Sept 2014 → 18 Sept 2014

Conference

Conference	5th Electronics System-Integration Technology Conference, ESTC 2014
Place	Finland
City	Helsinki
Period	16/09/14 → 18/09/14

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10.1109/ESTC.2014.6962849

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@inproceedings{9bc09710a1ea48938864fa4f35f3193e,

title = "Effect of pad shape on electromigration in solder bump joints",

abstract = "In this study, the effect of pad shape on current density and temperature distributions in solder joints has been investigated by three dimensional thermo-electrical finite element analysis. The simulation results show that square, hexagonal, octagonal and rounded pads with the same thickness/volume generate different current density and temperature distributions. The maximum current densities in solder bumps are 2.81×104, 2.62×104, 2.60×104 and 2.66×104 A/cm2 respectively, while the maximum temperatures are 183.3, 181.5, 181.2 and 182.2°C respectively. Solder joints with octagonal pads generate the smallest current density and temperature, indicating that this geometry has the best electromigration reliability. The results indicate that electromigration reliability can be improved by changing pad shape, without enlarging joint size. Pad shape design is a promising solder joint structure design method for enhancement of electromigration reliability in line with the miniaturization trends of future electronic products. Better design of the pad structure should help alleviate the electromigration reliability problem.",

author = "Yi Li and Chan, \{Y. C.\} and Xiuchen Zhao",

year = "2014",

month = nov,

day = "18",

doi = "10.1109/ESTC.2014.6962849",

language = "English",

isbn = "9781479940264",

booktitle = "Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014",

publisher = "IEEE",

address = "United States",

note = "5th Electronics System-Integration Technology Conference, ESTC 2014 ; Conference date: 16-09-2014 Through 18-09-2014",

}

TY - GEN

T1 - Effect of pad shape on electromigration in solder bump joints

AU - Li, Yi

AU - Chan, Y. C.

AU - Zhao, Xiuchen

PY - 2014/11/18

Y1 - 2014/11/18

N2 - In this study, the effect of pad shape on current density and temperature distributions in solder joints has been investigated by three dimensional thermo-electrical finite element analysis. The simulation results show that square, hexagonal, octagonal and rounded pads with the same thickness/volume generate different current density and temperature distributions. The maximum current densities in solder bumps are 2.81×104, 2.62×104, 2.60×104 and 2.66×104 A/cm2 respectively, while the maximum temperatures are 183.3, 181.5, 181.2 and 182.2°C respectively. Solder joints with octagonal pads generate the smallest current density and temperature, indicating that this geometry has the best electromigration reliability. The results indicate that electromigration reliability can be improved by changing pad shape, without enlarging joint size. Pad shape design is a promising solder joint structure design method for enhancement of electromigration reliability in line with the miniaturization trends of future electronic products. Better design of the pad structure should help alleviate the electromigration reliability problem.

AB - In this study, the effect of pad shape on current density and temperature distributions in solder joints has been investigated by three dimensional thermo-electrical finite element analysis. The simulation results show that square, hexagonal, octagonal and rounded pads with the same thickness/volume generate different current density and temperature distributions. The maximum current densities in solder bumps are 2.81×104, 2.62×104, 2.60×104 and 2.66×104 A/cm2 respectively, while the maximum temperatures are 183.3, 181.5, 181.2 and 182.2°C respectively. Solder joints with octagonal pads generate the smallest current density and temperature, indicating that this geometry has the best electromigration reliability. The results indicate that electromigration reliability can be improved by changing pad shape, without enlarging joint size. Pad shape design is a promising solder joint structure design method for enhancement of electromigration reliability in line with the miniaturization trends of future electronic products. Better design of the pad structure should help alleviate the electromigration reliability problem.

UR - https://www.scopus.com/pages/publications/84918548763

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84918548763&origin=recordpage

U2 - 10.1109/ESTC.2014.6962849

DO - 10.1109/ESTC.2014.6962849

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781479940264

BT - Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014

PB - IEEE

T2 - 5th Electronics System-Integration Technology Conference, ESTC 2014

Y2 - 16 September 2014 through 18 September 2014

ER -

Effect of pad shape on electromigration in solder bump joints

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