Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

Asit Kumar Gain; Y. C. Chan; K. C. Yung; Ahmed Sharif; Latir Ali

doi:10.1109/ESTC.2008.4684540

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

Asit Kumar Gain
, Y. C. Chan^*
, K. C. Yung
, Ahmed Sharif
, Latir Ali

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

5 Citations (Scopus)

Abstract

The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition ofnano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn3-Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively. ©2008 IEEE.

Original language	English
Title of host publication	Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages	1291-1294
DOIs	https://doi.org/10.1109/ESTC.2008.4684540
Publication status	Published - 2008
Event	2008 2nd Electronics Systemintegration Technology Conference, ESTC - Greenwich, United Kingdom Duration: 1 Sept 2008 → 4 Sept 2008

Conference

Conference	2008 2nd Electronics Systemintegration Technology Conference, ESTC
Place	United Kingdom
City	Greenwich
Period	1/09/08 → 4/09/08

Access Output

10.1109/ESTC.2008.4684540

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@inproceedings{9e9a6421998f491d8d10973d1fbe5ad4,

title = "Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages",

abstract = "The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition ofnano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn3-Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively. {\textcopyright}2008 IEEE.",

author = "Gain, \{Asit Kumar\} and Chan, \{Y. C.\} and Yung, \{K. C.\} and Ahmed Sharif and Latir Ali",

year = "2008",

doi = "10.1109/ESTC.2008.4684540",

language = "English",

isbn = "9781424428144",

pages = "1291--1294",

booktitle = "Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC",

note = "2008 2nd Electronics Systemintegration Technology Conference, ESTC ; Conference date: 01-09-2008 Through 04-09-2008",

}

Gain, AK, Chan, YC, Yung, KC, Sharif, A & Ali, L 2008, Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages. in Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC., 4684540, pp. 1291-1294, 2008 2nd Electronics Systemintegration Technology Conference, ESTC, Greenwich, United Kingdom, 1/09/08. https://doi.org/10.1109/ESTC.2008.4684540

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages. / Gain, Asit Kumar; Chan, Y. C.; Yung, K. C. et al.
Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. 2008. p. 1291-1294 4684540.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

AU - Gain, Asit Kumar

AU - Chan, Y. C.

AU - Yung, K. C.

AU - Sharif, Ahmed

AU - Ali, Latir

PY - 2008

Y1 - 2008

N2 - The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition ofnano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn3-Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively. ©2008 IEEE.

AB - The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition ofnano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn3-Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively. ©2008 IEEE.

UR - https://www.scopus.com/pages/publications/58149086226

UR - https://www.scopus.com/pages/publications/58149086226#tab=impact

U2 - 10.1109/ESTC.2008.4684540

DO - 10.1109/ESTC.2008.4684540

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781424428144

SP - 1291

EP - 1294

BT - Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

T2 - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Y2 - 1 September 2008 through 4 September 2008

ER -

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

Abstract

Conference

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this