Effect of nano-Ag3Sn additions on wettability, interfacial intermetallic growth and mechanical properties of Zn–30Sn–1Ge solders on Cu substrates

Yuhang Wei, Yingxia Liu, Chengwen Tan, Ji Zhang, Xiuchen Zhao*

*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

6 Citations (Scopus)

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Material Science

Chemical Engineering