Effect of Misalignment on the Electrical Characteristics of Anisotropic Conductive Adhesive Joints

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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Detail(s)

Original languageEnglish
Title of host publication2002 PROCEEDINGS - 52nd ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE
PublisherIEEE
Pages1605-1612
ISBN (Electronic)0-7803-7431-2
ISBN (Print)0-7803-7430-4
Publication statusPublished - May 2002

Publication series

NameProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISSN (Print)0569-5503

Conference

Title52nd Electronic Components and Technology Conference (ECTC 2002)
PlaceUnited States
CitySan Diego
Period28 - 31 May 2002

Abstract

The effect of misalignment on the electrical properties of anisotropic conductive film (ACF) joints is investigated in this work. It is found that along with the increase of misalignment, the connection resistance of ACF joints increases. When the misalignment in the x-direction is less than 5μm, the increase rate of connection resistance is quite large. Then, along with the severity of misalignment, the increase rate becomes smaller. Finally, when the misalignment is close to 20μm, the increase rate rises again. The Holm's electric contact theory is used for understanding the connection resistance variation. On the other hand, with the increase of misalignment in the x-direction, the insulation resistance between ACF joints decreases. If the misalignment exceeded 10μm, the decrease is prominent for the Ni particle ACF joints. This phenomenon can be explained by the effect of dielectric damage of the epoxy. The mathematical models are developed to calculate the variation of the probability of open and shorting after misalignment and predicate the maximum misalignment tolerance. The probability of open and shorting increase abruptly along with the increase of misalignment. On the view of pad parameters, the open probability is mainly related to the pad area, while the pads gap is critical to the shorting probability. So comparing to square shape pad, rectangle shape pad can reduce the failure probability greatly. From the point of ACF materials, high conductor loading-density decreases the open probability but increases the shorting probability. For a particular particle loading-density, decreasing the particle size appropriately can reduce both the open and shorting probability.

Citation Format(s)

Effect of Misalignment on the Electrical Characteristics of Anisotropic Conductive Adhesive Joints. / Fan, S. H.; Chan, Y. C.

2002 PROCEEDINGS - 52nd ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE. IEEE, 2002. p. 1605-1612 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review