Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Yu-An Shen; Chun-Ming Lin; Jiahui Li; Siliang He; Hiroshi Nishikawa

doi:10.1038/s41598-019-40268-4

Effect of FeCoNiCrCu_0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Yu-An Shen^*, Chun-Ming Lin, Jiahui Li, Siliang He, Hiroshi Nishikawa^*

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

14 Citations (Scopus)

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Abstract

High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu_0.5 HEA substrate was investigated. (Cu_0.76, Ni_0.24)₆Sn₅ intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu_0.5 HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu_0.5 substrate.

Original language	English
Article number	3658
Journal	Scientific Reports
Volume	9
DOIs	https://doi.org/10.1038/s41598-019-40268-4
Publication status	Published - 6 Mar 2019

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This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/

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title = "Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder",

abstract = "High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu0.5 HEA substrate was investigated. (Cu0.76, Ni0.24)6Sn5 intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu0.5 HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu0.5 substrate.",

author = "Yu-An Shen and Chun-Ming Lin and Jiahui Li and Siliang He and Hiroshi Nishikawa",

year = "2019",

month = mar,

day = "6",

doi = "10.1038/s41598-019-40268-4",

language = "English",

volume = "9",

journal = "Scientific Reports",

issn = "2045-2322",

publisher = "Nature Publishing Group",

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TY - JOUR

T1 - Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

AU - Shen, Yu-An

AU - Lin, Chun-Ming

AU - Li, Jiahui

AU - He, Siliang

AU - Nishikawa, Hiroshi

PY - 2019/3/6

Y1 - 2019/3/6

N2 - High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu0.5 HEA substrate was investigated. (Cu0.76, Ni0.24)6Sn5 intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu0.5 HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu0.5 substrate.

AB - High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu0.5 HEA substrate was investigated. (Cu0.76, Ni0.24)6Sn5 intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu0.5 HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu0.5 substrate.

UR - http://www.scopus.com/inward/record.url?scp=85062640406&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85062640406&origin=recordpage

U2 - 10.1038/s41598-019-40268-4

DO - 10.1038/s41598-019-40268-4

M3 - RGC 21 - Publication in refereed journal

C2 - 30842519

SN - 2045-2322

VL - 9

JO - Scientific Reports

JF - Scientific Reports

M1 - 3658

ER -

Effect of FeCoNiCrCu_0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

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Author Correction: Effect of FeCoNiCrCu_0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

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Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Abstract

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Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Cite this

Effect of FeCoNiCrCu_0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Author Correction: Effect of FeCoNiCrCu_0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder