Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

3 Scopus Citations
View graph of relations

Author(s)

  • Yu-An Shen
  • Chun-Ming Lin
  • Jiahui Li
  • Siliang He
  • Hiroshi Nishikawa

Related Research Unit(s)

Detail(s)

Original languageEnglish
Article number3658
Journal / PublicationScientific Reports
Volume9
Publication statusPublished - 6 Mar 2019

Link(s)

Abstract

High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu0.5 HEA substrate was investigated. (Cu0.76, Ni0.24)6Sn5 intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu0.5 HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu0.5 substrate.

Research Area(s)

Citation Format(s)

Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder. / Shen, Yu-An; Lin, Chun-Ming; Li, Jiahui; He, Siliang; Nishikawa, Hiroshi.

In: Scientific Reports, Vol. 9, 3658, 06.03.2019.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

Download Statistics

No data available