Effect of EFO parameters on the HAZ and bondability of gold wire

Wenyan Zhou; Yongjin Wu; Jialin Chen; Jianwen Kong; Guoxiang Yang; Jian Lu; Feifei Kang; Hongying Pei; Jianhong Yi

doi:10.1109/ICEPT.2018.8480579

Effect of EFO parameters on the HAZ and bondability of gold wire

Wenyan Zhou, Yongjin Wu, Jialin Chen, Jianwen Kong, Guoxiang Yang, Jian Lu, Feifei Kang, Hongying Pei, Jianhong Yi

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

5 Citations (Scopus)

Abstract

The effect of electrical flame off (EFO) discharge parameters on the heat affected zone (HAZ) and bondability of gold wire was studied in this paper. The wire was fired and then bonded in a ball bonding procedure, in which the effect of EFO supplying current and firing time was analyzed. The results show that the diameter of free air ball (FAB) increases as the EFO time or current increases on the basis of a same current or time. With the increase of EFO current on the basis of a comparable FAB size, both the length and the grain size of HAZ decrease. The wire exhibits increasing tensile breaking load and elongation in the HAZ, and wire pulling force after bonding with the increase of current. The FAB under higher current presents better deformability and smaller bonded ball height. However, decreasing of ball shear force indicates the decrease of bondability with the increase of current. © 2018 IEEE

Original language	English
Title of host publication	Proceedings
Subtitle of host publication	2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Editors	Tianchun YE, Fei XIAO, Jun WANG, Lin CHEN
Publisher	IEEE
Pages	413-418
ISBN (Electronic)	9781538663868, 978-1-5386-6385-1
ISBN (Print)	978-1-5386-6387-5
DOIs	https://doi.org/10.1109/ICEPT.2018.8480579
Publication status	Published - 2018
Event	19th International Conference on Electronic Packaging Technology, ICEPT 2018 - Shanghai, China Duration: 8 Aug 2018 → 11 Aug 2018 http://www.icept.org/en/

Publication series

Name	International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE

Conference

Conference	19th International Conference on Electronic Packaging Technology, ICEPT 2018
Place	China
City	Shanghai
Period	8/08/18 → 11/08/18
Internet address	http://www.icept.org/en/

Research Keywords

Bondability
Free air ball
Gold wire
Heat affected zone
Wire bonding

Access Output

10.1109/ICEPT.2018.8480579

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

Zhou, W., Wu, Y., Chen, J., Kong, J., Yang, G., Lu, J., Kang, F., Pei, H., & Yi, J. (2018). Effect of EFO parameters on the HAZ and bondability of gold wire. In T. YE, F. XIAO, J. WANG, & L. CHEN (Eds.), Proceedings: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (pp. 413-418). Article 8480579 (International Conference on Electronic Packaging Technology (ICEPT)). IEEE. https://doi.org/10.1109/ICEPT.2018.8480579

@inproceedings{fa17e159d51c43f4b7d81ef9f098b8be,

title = "Effect of EFO parameters on the HAZ and bondability of gold wire",

abstract = "The effect of electrical flame off (EFO) discharge parameters on the heat affected zone (HAZ) and bondability of gold wire was studied in this paper. The wire was fired and then bonded in a ball bonding procedure, in which the effect of EFO supplying current and firing time was analyzed. The results show that the diameter of free air ball (FAB) increases as the EFO time or current increases on the basis of a same current or time. With the increase of EFO current on the basis of a comparable FAB size, both the length and the grain size of HAZ decrease. The wire exhibits increasing tensile breaking load and elongation in the HAZ, and wire pulling force after bonding with the increase of current. The FAB under higher current presents better deformability and smaller bonded ball height. However, decreasing of ball shear force indicates the decrease of bondability with the increase of current. {\textcopyright} 2018 IEEE",

keywords = "Bondability, Free air ball, Gold wire, Heat affected zone, Wire bonding",

author = "Wenyan Zhou and Yongjin Wu and Jialin Chen and Jianwen Kong and Guoxiang Yang and Jian Lu and Feifei Kang and Hongying Pei and Jianhong Yi",

year = "2018",

doi = "10.1109/ICEPT.2018.8480579",

language = "English",

isbn = "978-1-5386-6387-5",

series = "International Conference on Electronic Packaging Technology (ICEPT)",

publisher = "IEEE",

pages = "413--418",

editor = "Tianchun YE and Fei XIAO and Jun WANG and Lin CHEN",

booktitle = "Proceedings",

address = "United States",

note = "19th International Conference on Electronic Packaging Technology, ICEPT 2018 ; Conference date: 08-08-2018 Through 11-08-2018",

url = "http://www.icept.org/en/",

}

Zhou, W, Wu, Y, Chen, J, Kong, J, Yang, G, Lu, J, Kang, F, Pei, H & Yi, J 2018, Effect of EFO parameters on the HAZ and bondability of gold wire. in T YE, F XIAO, J WANG & L CHEN (eds), Proceedings: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)., 8480579, International Conference on Electronic Packaging Technology (ICEPT), IEEE, pp. 413-418, 19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 8/08/18. https://doi.org/10.1109/ICEPT.2018.8480579

Effect of EFO parameters on the HAZ and bondability of gold wire. / Zhou, Wenyan; Wu, Yongjin; Chen, Jialin et al.
Proceedings: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). ed. / Tianchun YE; Fei XIAO; Jun WANG; Lin CHEN. IEEE, 2018. p. 413-418 8480579 (International Conference on Electronic Packaging Technology (ICEPT)).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Effect of EFO parameters on the HAZ and bondability of gold wire

AU - Zhou, Wenyan

AU - Wu, Yongjin

AU - Chen, Jialin

AU - Kong, Jianwen

AU - Yang, Guoxiang

AU - Lu, Jian

AU - Kang, Feifei

AU - Pei, Hongying

AU - Yi, Jianhong

PY - 2018

Y1 - 2018

N2 - The effect of electrical flame off (EFO) discharge parameters on the heat affected zone (HAZ) and bondability of gold wire was studied in this paper. The wire was fired and then bonded in a ball bonding procedure, in which the effect of EFO supplying current and firing time was analyzed. The results show that the diameter of free air ball (FAB) increases as the EFO time or current increases on the basis of a same current or time. With the increase of EFO current on the basis of a comparable FAB size, both the length and the grain size of HAZ decrease. The wire exhibits increasing tensile breaking load and elongation in the HAZ, and wire pulling force after bonding with the increase of current. The FAB under higher current presents better deformability and smaller bonded ball height. However, decreasing of ball shear force indicates the decrease of bondability with the increase of current. © 2018 IEEE

AB - The effect of electrical flame off (EFO) discharge parameters on the heat affected zone (HAZ) and bondability of gold wire was studied in this paper. The wire was fired and then bonded in a ball bonding procedure, in which the effect of EFO supplying current and firing time was analyzed. The results show that the diameter of free air ball (FAB) increases as the EFO time or current increases on the basis of a same current or time. With the increase of EFO current on the basis of a comparable FAB size, both the length and the grain size of HAZ decrease. The wire exhibits increasing tensile breaking load and elongation in the HAZ, and wire pulling force after bonding with the increase of current. The FAB under higher current presents better deformability and smaller bonded ball height. However, decreasing of ball shear force indicates the decrease of bondability with the increase of current. © 2018 IEEE

KW - Bondability

KW - Free air ball

KW - Gold wire

KW - Heat affected zone

KW - Wire bonding

UR - http://www.scopus.com/inward/record.url?scp=85056421672&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85056421672&origin=recordpage

U2 - 10.1109/ICEPT.2018.8480579

DO - 10.1109/ICEPT.2018.8480579

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 978-1-5386-6387-5

T3 - International Conference on Electronic Packaging Technology (ICEPT)

SP - 413

EP - 418

BT - Proceedings

A2 - YE, Tianchun

A2 - XIAO, Fei

A2 - WANG, Jun

A2 - CHEN, Lin

PB - IEEE

T2 - 19th International Conference on Electronic Packaging Technology, ICEPT 2018

Y2 - 8 August 2018 through 11 August 2018

ER -

Zhou W, Wu Y, Chen J, Kong J, Yang G, Lu J et al. Effect of EFO parameters on the HAZ and bondability of gold wire. In YE T, XIAO F, WANG J, CHEN L, editors, Proceedings: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE. 2018. p. 413-418. 8480579. (International Conference on Electronic Packaging Technology (ICEPT)). Epub 2018 Oct 4. doi: 10.1109/ICEPT.2018.8480579

Effect of EFO parameters on the HAZ and bondability of gold wire

Abstract

Publication series

Conference

Research Keywords

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this